Technical data is gathered for the products supported by this tool and is used to identify products, provide relevant solutions and automatically update this tool, to improve our products, solutions, services, and your experience as our customer. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations).This product detection tool installs software on your Microsoft Windows device that allows HP to detect and gather data about your HP and Compaq products to provide quick access to support information and solutions.
To see the detail process are as attached files including assemble panel.ģ.2 Optional Graphic. Remove the arm-rear and then unlock the 4 screws which they fix between the arm-front and the rion.ġ1. Unlock the 2 screws which they fix between the bottom-side and the base, and then unlock the 12 screws which they fix between the base and base-cover.ġ0. Unlock 2 screws for DVI port, D-SUB port, Power port, and 7 screws which they fix between chassis and PCA boards, power board and IF board. Unlock the 2 screws which they fix the chassis and panel, and then pull the LVDS out. Seprate the Keypad and backcover with handħ. Remove the backcover with hand from Product.Ħ. Remove the front bezel with hand from productĥ. Unlock the 4 screws which they fix the stand by 2# screwdriver.Ĥ. Unlock the 4 screws which they fix the VESA mounting by 2# screwdriver.ģ. Lay the monitor on the desk, remove the VESA mounting cover with hand.Ģ. List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed.ģ.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:ġ. Including liquids, semi-liquids (gel/paste) and tonerĬomponents, parts and materials containing Include the cartridges, print heads, tubes, vent Plastics containing Brominated Flame RetardantsĬomponents and parts containing toner and ink, Greater than 2.5 cm in diameter or height Includes background illuminated displays with gasĬapacitors / condensers (Containing PCB/PCT)Įlectrolytic Capacitors / Condensers measuring Liquid Crystal Displays (LCD) with a surface greater Printed Circuit Boards (PCB) or Printed CircuitĪll types including standard alkaline and lithium coinįor example, mercury in lamps, display backlights, It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).ġ.1 Items listed below are classified as requiring selective treatment.ġ.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable. Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. HP 2309m HP 2309v Name / Model 3 Name / Model 4 Name / Model 5 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. Product End-of-Life Disassembly Instructions Product Category: Monitors and Displays Marketing Name / Model List multiple models if applicable.